HBM3 at top of 665 Gb / s bandwidth per chip, according to SK Hynix
Although high bandwidth memory (HBM) has not yet become a mainstream type of DRAM for graphics cards, it is a memory of choice for data centers and bandwidth-intensive business applications. . HBM3 is the next step, and this week SK Hynix unveiled plans for its HBM3 offering, bringing us new insight into the expected bandwidth of the upcoming specification.
SK Hynix’s current HBM2E memory stacks offer unbeatable 460 GB / s bandwidth per device. JEDEC, which makes the HBM standard, has not yet formally standardized HBM3. But just like other memory manufacturers, SK Hynix has been working on the next generation HBM for some time.
Its HBM3 offering is currently “in development,” according to an updated page on the company’s website, and “will be capable of processing over 665 GB of data per second at 5.2 Gbps in speed. ‘I / O’. This is against 3.6 Gbit / s in the case of HBM2E.
SK Hynix also expects bandwidth equal to or greater than 665 Gb / s per stack, compared to SK Hynix’s HBM2E of 460 Gb / s. Notably, some other companies, including SiFive, expect HBM3 to scale up to 7.2 GTps.
These days, bandwidth-hungry devices like ultra-high-end computing GPUs or FPGAs use 4-6 stacks of HBM2E memory. With SK Hynix’s HBM2E, these applications can achieve bandwidth of 1.84 to 2.76 TB / s (generally lower because GPU and FPGA developers are cautious). With HBM3, these devices could get at least 2.66 to 3.99 TB / s of bandwidth, according to the company.
SK Hynix has not communicated a planned release date for HBM3.
In early 2020, SK Hynix licensed DBI Ultra 2.5D / 3D hybrid link interconnect technology from Xperi Corp., specifically for high bandwidth memory solutions (including 3DS, HBM2, HBM3 and beyond ), as well as various highly integrated processors, GPUs, ASICs, FPGAs and SoCs.
The DBI Ultra supports 100,000 to 1,000,000 interconnects per square millimeter and allows stacks of up to 16, enabling ultra-high capacity HBM3 memory modules, as well as 2.5D or 3D solutions with integrated HBM3 .